CRYSTALAS CVL — C

Cutting and drilling system

“CRYSTALAS CVL-C” system that consist of copper vapor laser and chamber containing an optical system and a coordinate table to move the object. The laser is equipped with a telescopic unstable resonator which allows you to receive the radiation divergence close to diffraction limit. This makes it possible to form on the surface of the object being processed spot laser treatment of the diameter from 10 to 50 microns with a power density of up to 10>11 W/sq.sm. In conjunction with pulse repetition frequency 16000Hz it allows for cutting and drilling of virtually any material thickness up to hundreds of micrometers at high speeds (up to 100 mm per second) with an accuracy of 10 microns.

An important application of “CRYSTALAS CVL – C” system a semiconductor scribing sapphire substrates and their subsequent separation of the crystals. The width and depth of “scribing track” of a few tens of micrometers.

The installation provides the following modes of operation:

  • Pass-through metal cutting;
  • Scribing and subsequent separation;
  • Drilling with the removal of material;
  • “Pouring” holes of different shapes of the beam scanning.
Specifications:
Materials Metals, plastics, semiconductors, ceramics, sapphire
Material thickness Up to 1 mm
Minimum hole diameter 30 mkm
Minimum cutting width 10 mkm
Processing field 100x100 mm
Cutting speed less than 100 mm per second
Coordinate and the optical system X, Y – coordinate table; X, Y - Coordinate Scanning Devices (to order); lens f=100mm; telescopic resonator
Type of laser Copper vapor laser
Cooling air
Power 220W, 50 Hz, one phase
Power consumption 3 kW
Dimensions 1200x300x600 mm
Weight 75 kg
Performance table

CRYSTALAS CVL — M

System for laser marking of products

“CRYSTALAS CVL-M” installation consists of copper vapor laser CVL-10, galvanometer X, Y - scanners, moving the beam hole on the surface of a stationary object and a focusing optical system.

The laser is equipped with a telescopic unstable resonator which allows you to receive the radiation divergence close to diffraction limit. This makes it possible to form on the surface of the object being processed spot laser treatment of the diameter from 10 to 50 microns with a power density of up to 10>11 W/sq.sm. In conjunction with pulse repetition frequency 16000Hz it allows for marking of almost any kind of materials with speed of up to 100 mm per second, with an accuracy 10 mkm.


Specifications:
MaterialsMetals, plastics, semiconductors, ceramics, sapphire plates.
Minimum line width10 mkm
Marking field with stationary object50x50 mm
SpeedMore then 10 characters per second
Optical systemX, Y Coordinate Scanning Devices, lens f=100mm, telescopic resonator
Type of laserCopper Vapor Laser CVL-10
CoolingAir
Power220 W, 50 Hz, one phase
Power consumption 3 kW
Dimensions1200x300x600mm
Weight75 kg
PerformanceTable

CRYSTALAS CVL — MM

System for laser micro-marking of diamond and other materials

УThe unit is designed to form on the surface of various materials invisible to the naked eye alphanumeric and graphical information. The process is based on surface evaporation materials or change its optical properties.

“CRYSTALAS CVL-MM” system consists of copper vapor laser amplifier. It is CVL-10 laser without tradional resonator’s mirrors and projection optical system.

The specified pattern is formed by marking a controlled electro mechanical or mechanical masks. Using a laser amplifier copper vapor allows you to use programmable electro-optical matrix to form on the surface of virtually any material and images inscription above the miniature size (1 to 300 microns). These invisible to the naked eye, the image can be seen in powerful microscope.

The system is used for the hidden micro-markingl of any products, including rough and diamonds for the purpose of certification.

Specification:
Size of the image field 1-300 mkm
Minimum line width 1 mkm
Depth of processing Up to 0,4 mkm
Increase visual surveillance system More 1000x
Type of laser Copper vapor laser
Cooling Air
Power 220W, 50-60 Hz
Dimensions 1100x400x600 mm
Weight 50kg

CRYSTALAS — LF

Laser system for internal photos and images creation inside crystals

The unit is designed to produce a new type of targeted products — internal laser photographs, combined with a targeted three-dimensional images such as signs of the zodiac, wedding logo and address text. Also it is congratulations, name and logo of companies in the heavy plate-glass optical.

The operating principle of the device is based on the process of getting inside the thick glass of the scattering region — the point by focusing the laser radiation. The size of this point is several tens of micrometers.

Superposition of points obtained on the basis of the specified printer is formed by drawing, photography, lettering, etc. When you move to 3 point coordinates obtained by three-dimensional image of the object.

Specifications
Image size (X, Y, Z) 350x350x50 mm
Minimal size of point 20 – 100 microns
Discrete image 100 microns
Type of laser Copper vapor laser
Cooling Air
Power 220W, 50-60 Hz, one phase
Dimensions 2000x1000x1500mm
Weight 150 kg

CRYSTALAS — 3D

System for the manufacture of decorative glass products to the internal images

Manufacture of decorative articles made of optical glass, crystals, and optically transparent plastic with internal three-dimensional images.

Specifications:
Point size 50 – 300 microns
Process Up to 50 points per second
Maximal object size 80x80x80 mm
Type of laser Solid YAG-laser
Dimensions 1100x250x500 mm
Weight 75 kg
Power consumption 3 kW

CRYSTALAS — 2D

System for the manufacture of decorative glass products in the image of a large size

Installation allows you to create gray scale images by sequentially introducing a glass thickness mikro dots points within a certain distance from each other. The most used after the interior details are: doors, tables, showcases, etc.

Specifications:
Processed material Glass, Plastic
Point size 50-300 microns
Process speed Up to 50 points per second
Maximal object size 2 x 3 m
Maximal image size 1,5 x 2 m
Material thickness 3-20 mm
Type of laser Solid YAG laser
Dimensions 3200x2200x850mm
Weight 150 kg
Power consumption 3 kW

MALK ( Multifunctional Automated Laser Complex )

MALK Applications:

  • Laser technologies;
  • Scientific researches;
  • Education.

MALK features:

  • Simultaneous with the processing of visual control;
  • Increase &qt; 1000х;
  • Resolution 0,5 μ;
  • Size of spot treatment 0,5 — 2500 μ;
  • Power density 0 — 1011 W/sm2;

The field of scientific researches and education:

  • Optics;
  • Spectroscopy;
  • Laser technics and technology;
  • Microscopy;
  • Materials;
  • Micro electronics;
  • Getting nanomaterial;
  • Advertisement information;
  • Microbiology;
  • Laser medicine;
  • Nonlinear optics.

Table option of MALK

Control of laser processing on the monitor and on the screen of laser micro projector

Ongoing processes:

  • photo stimulated chemical reactions;
  • local heating and heat treatment;
  • modification of surfaces and recrystallization;
  • local evaporation materials;
  • local effects on biological objects;
  • getting nanomaterial;
  • laser marking including micro marking;
  • drilling of micro holes in different materials ;
  • correcting defects in microstructures;
  • laser lithography;
  • laser cutting and scribing;
  • fitting the parameters of electronic components;
  • processing of thin films.

Specifications:
Lens focal length 160 90 30 14
Increase of the laser projector, times 100 200 500 1000
Field of view, mm 1,9x2,5 0,95x1,3 0,4x0,51 0,2x0,25
Resolutions, microns 6 3 1,5 0,7
Size range of laser processing, microns 10-2500 5-1300 2-500 0,7-250
Type of laser Copper vapor laser
The average power laser in the generation of at least 10 W
Wavelength 510,6 578,2nm
Pulse repetition frequency 12-16 kHz
Pulse duration 20 ns
Power density at the site 0-1011 W/sm2
Cooling Air
Power 220W, 50 Hz, one phase
Power consumption 3 kW
Dimensions 1500x500x1000mm
Weight 80 kg